Quality Assurance Guarantee  //  Overview

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"The purpose of this guarantee is to inform you, our potential customer, of the importance we give to qual­ity assurance in making the printed circuit boards you order. A complete, detailed list of all quality assurance steps taken at Circuit Reproduction Co. would require far more space than is practical. This listing should give you an idea of the great care we take. We welcome your questions and will gladly explain our QC proce­dures in greater detail. Each step below refers to the work of highly trained QC personnel, independent of the department heads:"

PHOTO DEPARTMENT: 1. Checks the revision number, artwork-to-print. 2. Checks artwork for front-to-back registration. 3. Measures overall length and width of artwork and assures agreement with custo­mer's specifications. 4. Checks circuit width and spac­ing between circuitry to assure compliance with custo­mer's specifications. 5. Checks artwork for imperfections such as pinholes, broken circuit and make necessary corrections.

DRILLING DEPARTMENT: First piece inspection for the following: 1. Hole quality. 2. Missing holes. 3. Extra holes.  4. Mislocated holes. 5. Registration 6. Proper revision number. 7. Hole-to-hole dimensioning. 8. Hole size. 9. Grid check, if specified. 10. Slots and/or other cutouts.

DEPOSITION DEPARTMENT: 1. Visually inspects panels for nodules or debris after deburring. 2. Checks baths daily for correct chemistry and possible contami­nation. 3. Inspects panels for voids, nodules and sur­face imperfections after scrubbing.

DRY FILM DEPARTMENT: Temperature and humid­ity are carefully controlled and continually monitored. Cleanliness is maintained at the highest level of clean- room conditions throughout the working day. In addi­tion, the following are among steps taken: 1. Each panel, after being checked for the foreign particles possibly trapped under the resist, is racked in a way to minimize surface scratching. 2. Tooling film is checked for correct revision number, pinholes or breaks, and correct registration. 3. Exposure units are maintained dirt-free. 4. Step tablets are performed every two hours to assure correct exposure duration. 5. First piece inspection checks for registration, line width and image quality.

PLATING DEPARTMENT: Plating baths are moni­tored daily by our laboratory for chemical composi­tion, possible contamination, and proper temperatures. Panels from each order are checked for proper adher­ence to plating requirements.

ETCHING DEPARTMENT: With respect to etching machines, the following procedure is rigidly adhered to: 1. The etching solution is checked daily for specific gravity and pH. 2. Correct temperature is checked and maintained in both chambers. 3. Undercut is moni­tored frequently throughout the day.

REFLOW DEPARTMENT: Each order is carefully checked after reflow to ensure clean, bright holes. The appearance of burning, de-wetting or flux residue is the subject of careful scrutiny, and the presence of any of these conditions is cause for immediate rejection.

SCREENING DEPARTMENT: All orders solder masked and/or letter screened are subjected to first piece inspection for: 1. Correct registration. 2. Legibil­ity. 3. Complete coverage of all circuits. 4. Proper cur­ing and adhesion.

GOLD PLATING DEPARTMENT: Baths are analyzed daily by our laboratory. Baths are analyzed bi-weekly by our gold supplier. In addition: 1. Plating thickness is monitored to meet customer specifications on an A.Q.L. basis. 2. Each order is tape-tested to ensure satisfactory adhesion.

FABRICATION DEPARTMENT: A first piece is run on each order and is inspected for: 1. Outside dimen­sions. 2. Slot placement. 3. Hole dimensions. 4. Chamfer depth. 5. All other special customer specifica­tion requirements. 6. In addition random checks on all of the above are made periodically.

FINAL INSPECTION: Every finished board is visually inspected for: 1. Registration. 2. Short circuits. 3. Voids. 4. Hole quality. 5. Circuit definition. Every fin­ished board is mechanically tested for: 1. Proper plat­ing thickness of copper, gold, nickel, and tin-lead. 2. Correctness of all internal and external dimensions. 3. Warp-age.

Electronic testing of bare boards is available upon customer request.